Low-Temperature Cross-Linkable Hole Transport Material Based on Carbazole Derivatives Design and Applications in Solution-Processed OLEDs

Triphenylamine Carbazole Moiety Organic Electronics
DOI: 10.1021/acs.macromol.4c00227 Publication Date: 2024-04-16T20:14:20Z
ABSTRACT
Cross-linking is demonstrated to be an effective strategy resolve the interface erosion problem facing solution process technique for large area commercial applications of organic electronics. However, most reported cross-linkable materials require a high temperature over 150 °C, which detrimental device performance. In this study, in situ cross-linking protocol proposed based on triphenylamine/carbazole core linked with hexyl chain and styryl moiety, low down 120 °C achieved first time. The resultant thermally hole transportation molecules TPA-VBCz HTPA-VBCz possess triplet energy levels around 3.0 eV decomposition temperatures 410 °C. solution-processed layer (HTL) cured at 30 min finish net structure. Applications HTL multilayer delayed fluorescent green OLEDs are explored significantly improved current efficiency up 78.3 cd A–1 external quantum 24.6%.
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