Improving the Robustness of Organic Semiconductors through Hydrogen Bonding

• DOI: 10.1021/acsami.0c18928
• Publication Date: 2021-02-13T04:52:54Z
• Authors: Paula Gómez; Stamatis Georgako...; Miriam Más-Montoya; Jesús Cerdá; José Pérez; Enrique Ortí; Juan Aragó; David Curiel
• Keywords: hydrogen-bonded material; supramolecular expansion; hydrogen bond donor; Hydrogen Bonding Molecular organization; Chemical Sciences not elsewhere classified; acceptor sites control; Biophysics; Organic Semiconductors; Charge transport; Biochemistry; 01 natural sciences; Hole-transporting materials; Inorganic Chemistry; Organicfield-effect transistors; 0103 physical sciences; Genetics; Molecular Biology; Cancer; Pharmacology; Evolutionary Biology; Química Inorgánica; Organic electronics; field-effect transistors; heptacyclic molecules; 2211.25 Semiconductores; Cell Biology; Hematology; Self-assembly; X-ray diffraction; charge transport; Hydrogen-bonded materials; 0104 chemical sciences; charge transport properties; Infectious Diseases; π-; Organic semiconductors; Medicine; Physical Sciences not elsewhere classified; hydrogen bond-directed self-assembly; Biotechnology

Molecular organization plays an essential role in organic semiconductors since it determines the extent of intermolecular interactions that govern the charge transport present in all electronic applications. The benefits of hydrogen bond-directed self-assembly on charge transport properties are demonstrated by comparing two analogous pyrrole-based, fused heptacyclic molecules. The rationally designed synthesis of these materials allows for inducing or preventing hydrogen bonding. Strategically located hydrogen bond donor and acceptor sites control the solid-state arrangement, favoring the supramolecular expansion of the π-conjugated surface and the subsequent π-stacking as proved by X-ray diffraction and computational calculations. The consistency observed for the performance of organic field-effect transistors and the morphology of the organic thin films corroborate that higher stability and thermal robustness are achieved in the hydrogen-bonded material.