Rapid Selective Ablation and High-Precision Patterning for Micro-Thermoelectric Devices Using Femtosecond Laser Directing Writing

• DOI: 10.1021/acsami.1c21326
• Publication Date: 2022-01-05T18:31:01Z
• Authors: Jie Zhou; Wei Zhu; Yujie Xie; Yuedong Yu; Zhanpeng Guo; Qingqing Zhang; Yutong Liu; Yuan Deng
• Keywords: Laser Ablation

Highly integrated miniature thermoelectric (TE) devices are desirable for applications of chip thermal management and self-powered energy harvesting. Currently, further performance improvement micro-TE is largely limited by micro-nano-patterned processing, which shows the incompatibility with high-performance TE material fabrication or contradiction between machining accuracy efficiency. This work presents a useful method to flexibly achieve high-precision array patterning device through femtosecond laser direct writing technique. By experimentally examining ablation process numerically analyzing electron-lattice temperature, threshold different materials determined obtain selective removal metallic electrodes. Furthermore, evaluation criteria established formation quality microgroove in structure pulse distribution, shape-control property-control pattern processing can be realized reasonable control energy. Consequently, Bi2Te3-based competitive leg density (496 pairs/cm2) high filling factor (55%) successfully constructed.