Ultrasoft and High-Adhesion Block Copolymers for Neuromorphic Computing

Neuromorphic engineering
DOI: 10.1021/acsami.3c19350 Publication Date: 2024-02-27T20:45:17Z
ABSTRACT
The "von Neumann bottleneck" is a formidable challenge in conventional computing, driving exploration into artificial synapses. Organic semiconductor materials show promise but are hindered by issues such as poor adhesion and high elastic modulus. Here, we combine polyisoindigo-bithiophene (PIID-2T) with grafted poly(dimethylsiloxane) (PDMS) to synthesize the triblock-conjugated polymer (PIID-2T-PDMS). exhibited substantial enhancements (4.8-68.8 nN) reductions modulus (1.6-0.58 GPa) while maintaining electrical characteristics of PIID-2T. three-terminal organic synaptic transistor (three-terminal p-type synapse (TPOAS)), constructed using PIID-2T-PDMS, exhibits an unprecedented analog switching range 276×, surpassing previous records, remarkable memory on-off ratio 106. Moreover, device displays outstanding operational stability, retaining 99.6% its original current after 1600 write-read events air. Notably, TPOAS replicates key biological behaviors, including paired-pulse facilitation (PPF), short-term plasticity (STP), long-term (LTP). Simulations handwritten digital data sets reveal impressive recognition accuracy 91.7%. This study presents polyisoindigo-bithiophene-based block copolymer that offers enhanced adhesion, reduced modulus, high-performance synapses, paving way for next generation neuromorphic computing systems.
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