Enhanced Wet-Chemical Etching To Prepare Patterned Silicon Mask with Controlled Depths by Combining Photolithography with Galvanic Reaction

Isotropic etching Galvanic cell Microscale chemistry Template Dry etching
DOI: 10.1021/ie201996t Publication Date: 2011-12-05T18:04:36Z
ABSTRACT
We have developed an enhanced wet-chemical method to prepare patterned silicon templates with controlled depths at microscale by combining photolithography electroless metal etching. The masks are obtained in the following procedures: wafers selectively etch through galvanic reactions and result surfaces nanoarrays exposed areas during photolithography; as-etched corroded a mixture etching solution remove nanoarrays, leading templates.
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