Nondestructive Contact Deposition for Molecular Electronics: Si-Alkyl//Au Junctions

• DOI: 10.1021/jp104130w
• Publication Date: 2010-07-07T17:00:23Z
• Authors: Nir Stein; Roman Korobko; Omer Yaffe; Rotem Har Lavan; Hagay Shpaisman; Einat Tirosh; Ayelet Vilan; David Cahen
• Keywords: Molecular Electronics; Contact resistance; Electrical contacts

One of the major problems in molecular electronics is how to make electronically conducting contact "soft" organic and biomolecules without altering molecules. As a result, only small number metals can be applied, mostly by special deposition methods with severe limitations. Transferring predefined thin metal leaf onto layer provides nondestructive, noninvasive contacting method that is, principle, applicable many types variety metal/molecules combinations. Here we report modification our earlier lift-off, float-on (LOFO) method, using as basis its offspring, polymer-assisted lift-off (PALO) where backing polymer enables simultaneous multiple contacts well reduces wrinkles leaf. The modified PALO (MoPALO) reported here, adds lithography steps obviate need punch through polymer, done complete contacts. Morphological characterization electrodes indicates highly uniform, wrinkle-free negligible roughness. good electrical performance MoPALO was proven metal/organic-monolayer/semiconductor (MOMS) junctions, which are known very sensitive degradation penetration. We also show enabled us compare effect varying work function area on current−voltage characteristics MOMS devices.