Free-Standing Organic Transistors and Circuits with Sub-Micron Thicknesses
Flexible Electronics
Robustness
DOI:
10.1038/srep27450
Publication Date:
2016-06-09T09:25:35Z
AUTHORS (6)
ABSTRACT
Abstract The realization of wearable electronic devices with extremely thin and flexible form factors has been a major technological challenge. While substrates typically limit the thickness thin-film devices, they are usually necessary for their fabrication functionality. Here we report on ultra-thin organic transistors integrated circuits using device components whose that have removed. fabricated total thicknesses down to 350 nm electrical performance levels close those conventional substrates. Moreover, exhibit excellent mechanical robustness, whereby static dynamic characteristics do not change even under 50% compressive strain. Tests systematically applied strains reveal these free-standing possess anisotropic stability strain model multilayer stack can be used describe in this sort device. These results show feasibility ultimate-thin constructions.
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