Surface and interface structural analysis of W deposited on 6H–SiC substrates annealed in argon

Oxygen Temperatures Rutherford backscattering spectrometry (RBS) Scanning electron microscopy (SEM) 669 Grazing incidence X-ray diffraction (GIXRD) 02 engineering and technology 0210 nano-technology Crystals
DOI: 10.1039/c6ra24825j Publication Date: 2016-12-22T19:55:31Z
ABSTRACT
A study of a tungsten (W) thin film deposited on single crystalline 6H–SiC substrate and annealed in Ar at temperatures 700 °C, 800 900 °C 1000 for 1 hour was conducted.
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (31)
CITATIONS (9)