Surface and interface structural analysis of W deposited on 6H–SiC substrates annealed in argon
Oxygen
Temperatures
Rutherford backscattering spectrometry (RBS)
Scanning electron microscopy (SEM)
669
Grazing incidence X-ray diffraction (GIXRD)
02 engineering and technology
0210 nano-technology
Crystals
DOI:
10.1039/c6ra24825j
Publication Date:
2016-12-22T19:55:31Z
AUTHORS (5)
ABSTRACT
A study of a tungsten (W) thin film deposited on single crystalline 6H–SiC substrate and annealed in Ar at temperatures 700 °C, 800 900 °C 1000 for 1 hour was conducted.
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