SiGe Esaki tunnel diodes fabricated by UHV-CVD growth and proximity rapid thermal diffusion

Tunnel diode
DOI: 10.1049/el:20040048 Publication Date: 2004-01-07T12:44:44Z
ABSTRACT
A process for realisation of SiGe Esaki diodes in layers grown by ultra-high vacuum chemical vapour deposition has been developed and the first are reported this growth method. Intrinsic SiGe-layers on highly boron-doped p+-Si layers, while post-growth proximity rapid thermal diffusion phosphorous into is employed to form an n+-layer. Tunnel with a depletion layer width about 6 nm have realised Si0.74Ge0.26, showing peak current density 0.18 kA/cm2 peak-to-valley ratio 2.6 at room temperature.
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