Thermal stability of polyphenylsilsesquioxane‐modified meta‐aramid insulation paper

• DOI: 10.1049/hve.2019.0266
• Publication Date: 2020-02-04T02:38:45Z
• Authors: Chao Tang; Wei Zheng; Lihan Wang; Jufang Xie
• Keywords: Aramid; Thermal Stability

The development of new materials for use in advanced distribution transformers is required to improve their heat resistance rating, operational safety, and reliability. combination polymer nanoparticles the preferred approach thermal stability materials. In this study, laboratory-prepared meta-aramid insulation paper modified with polyphenylsilsesquioxane (PPSQ) was evaluated. results showed that superior unmodified paper. Molecular dynamics simulations were used analyse internal mechanism performance improvement achieved by modification PPSQ. From a microscopic perspective, addition PPSQ provided relatively larger structural space fibre increased free volume entire system, which tightened molecular chains, density structure paper, enhanced mutual permeability between chains. Therefore, stress can be better transmitted, loss such as phase delamination effectively prevented, bonding fibres strengthened.