Pressure activated interconnection of micro transfer printed components

• DOI: 10.1063/1.4950992
• Publication Date: 2016-05-18T17:00:32Z
• Authors: Carl Prevatte; Ibrahim Guven; Kanchan Ghosal; David Gomez; Tanya Moore; Salvatore Bonafede; Brook Raymond; António Jose Trin...; Alin Fecioru; David Kneeburg; Matthew A. Meitl; Christopher A. Bower
• Keywords: Microsystem; Wire bonding; Transfer molding; Electronic component

Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems miniaturized components on non-native substrates. Most assembled include electrical interconnections to the components, typically accomplished by metal wires formed substrate after operation. An alternative scheme establishing during operation is a cost-effective manufacturing method for producing heterogeneous microsystems, facilitates repair such as displays, ex post facto addition correct defects system-level tests. This letter describes pressure-concentrating conductor structures silicon (1 0 0) wafers establish connections preexisting conductive traces glass plastic substrates with an elastomer stamp. The pressure concentrators penetrate polymer layer form connection, reflow bonds securely target substrate. experimental yield series-connected test >1000 demonstrates suitability process manufacturing, robustness against exposure thermal shock, damp heat, mechanical flexure shows reliability resulting bonds.