Scaling photonic integrated circuits with InP technology: A perspective

• DOI: 10.1063/5.0200861
• Publication Date: 2024-05-16T15:53:17Z
• Authors: Yi Wang; Yuqing Jiao; Kevin Williams
• Keywords: Applied optics. Photonics; TA1501-1820

The number of photonic components integrated into the same circuit is approaching one million, but so far, this has been without large-scale integration active components: lasers, amplifiers, and high-speed modulators. Emerging applications in communication, sensing, computing sectors will benefit from functionality gained with high-density active–passive integration. Indium phosphide offers richest possible combinations components, past decade, their pace scaling not kept up passive realized silicon. In work, we offer a perspective for functional circuits actives passives on InP platforms, axes component miniaturization, areal optimization, wafer size scaling.