Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser

0103 physical sciences 01 natural sciences QC
DOI: 10.1103/physrevapplied.3.064013 Publication Date: 2015-06-19T13:08:25Z
ABSTRACT
Simulations and experiments are used to study extreme-ultraviolet (EUV) laser drilling of submicrometer holes. The ablation process is studied with a 2D Eulerian hydrodynamic code that includes bound-free absorption processes relevant to the interaction of EUV lasers with a solid material. Good agreement is observed between the simulated and measured ablated depths for on-target irradiances of up to 1×1010  W cm−2. An increase in the irradiance to 1×1012  W cm−2 is predicted to ablate material to a depth of 3.8  μm from a single pulse with a hole diameter 3 to 4 times larger than the focal spot size. The model allows for the simulation of the interaction of a laser pulse with the crater created by a previous shot. Multiple-pulse lower-fluence irradiation configurations under optimized focusing conditions, i.e., approaching the diffraction limit, are shown to be advantageous for applications requiring mesoscale [(100  nm)–(1  μm)] features and a high level of control over the ablation profile.
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (26)
CITATIONS (26)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....