Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser

• DOI: 10.1103/physrevapplied.3.064013
• Publication Date: 2015-06-19T13:08:25Z
• Authors: Andrew K. Rossall; Valentin Aslanyan; Greg J. Tallents; Ilya Kuznetsov; Jorge J. Rocca; Carmen S. Menoni
• Keywords: Extreme Ultraviolet Lithography; Extreme ultraviolet; Laser Ablation; Ultraviolet

Advanced mesoscale devices require tight tolerances of very fine features. Laser ablation is widely used for this purpose, and extreme-ultraviolet (EUV) lasers in particular allow a tighter focus lower-temperature machining than traditional lasers. The authors perform simulations experiments laser using an EUV laser, producing high-aspect-ratio (100 nm---1\textmu{}m) features with high level control over the profile. This work provides effective technique to investigate promote capillary-discharge technology industrial processes.