Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser
Extreme Ultraviolet Lithography
Extreme ultraviolet
Laser Ablation
Ultraviolet
DOI:
10.1103/physrevapplied.3.064013
Publication Date:
2015-06-19T13:08:25Z
AUTHORS (6)
ABSTRACT
Advanced mesoscale devices require tight tolerances of very fine features. Laser ablation is widely used for this purpose, and extreme-ultraviolet (EUV) lasers in particular allow a tighter focus lower-temperature machining than traditional lasers. The authors perform simulations experiments laser using an EUV laser, producing high-aspect-ratio (100 nm---1\textmu{}m) features with high level control over the profile. This work provides effective technique to investigate promote capillary-discharge technology industrial processes.
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