Optimization of the Microwave Induced Plasma system for failure analysis in integrated circuit packaging

• DOI: 10.1109/icept.2010.5582713
• Publication Date: 2010-09-29T18:06:11Z
• Authors: J. Tang; J.B.J. Schelen; C.I.M. Beenakker
• Keywords: Plasma Etching; Integrated circuit packaging; Microwave power

Decapsulation of plastic Integrated Circuit (IC) packages is an important step in package level failure analysis. In this paper, optimization a Microwave Induced Plasma (MIP) system for IC decapsulation described. An improvement on the microwave coupling MIP achieved and power reflection reduced from more than 50% to less 15%. Results oxygen plasma etching samples showed that by only not practical. carbontetrafluoride mixture etch rate 0.55 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> /min at 390°C effluent temperature. High selectivity ensured copper wires be intact after decapsulation. Parameters affect performance are discussed results shown prove high efficiency method.