Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM

• DOI: 10.1109/jlt.2022.3175518
• Publication Date: 2022-05-19T20:26:29Z
• Authors: Huimin He; Haiyun Xue; Yu Sun; Fengman Liu; Liqiang Cao
• Keywords: Interposer; Ball grid array; Motherboard

Recently, the interconnection bandwidth of data center is rapidly increasing. To satisfy requirement for high-performance center, a 4-channel 2.5D silicon photonic transmitter proposed and packaging structure could increase high-density scalability architecture 1.6T/3.2T co-packaging optics (CPO) module. The electrical driver Mach-Zehnder modulator (MZM) are mounted to interposer by micro-bumps. Meanwhile, low temperature co-fired ceramic solder balls. assembled motherboard high-speed ball grid array (BGA) connector make it convenient be replaced. optimization implemented insertion loss whole passive link within −1.55 dB under 40 GHz, which ensures with socket transmit clear simulated eye diagram at 64 Gbps PAM4 rate per channel. Moreover, thermal evaluation performed, includes heat- dissipation thermal-induced impact on edge light coupling. Finally, substrates in fabricated realized improved assembly method. By verification measurement, we work signal transmission channel 6pJ/bit power consumption. Regardless electronic integrated circuit (EIC)/MZM BGA connector, based simulation bandwidth, potential realizing 100 transmission.