Numerical Analysis on Thermal Deformation of Linear Motor in Chip Mounter

• DOI: 10.1115/imece2011-63611
• Publication Date: 2012-08-03T09:08:22Z
• Authors: Kang-Woo Joo; Kwang-Sun Kim; Jun-Young Kim; Hee-Rak Beom
• Keywords: Reciprocating motion; Linear motion; Ball screw

In the semiconductor chip mounting process, size of chips is decreasing, while number per time are increasing, and this trend being accelerated. The research activities to develop mounters, which able mount rapidly accurately, have been needed in industry. With background, linear motor mounters has an important part. electro-magnetic type many advantages such as direct reciprocating motion compared with rotary ball screw motor. However, thermal problems. These problems affect life performance bring out other stress deformation. heat transfer analysis difficult solve because moving fixed parts coexist. trial & error methods therefore used under majority cases. paper, we investigated deformation a mounter optimized parameters design were obtained.