Advanced flexible electronics: challenges and opportunities

• DOI: 10.1117/12.2051716
• Publication Date: 2014-06-04T21:56:11Z
• Authors: Stephen W. Bedell; Davood Shahrjerdi; Keith Fogel; Paul Lauro; Can Bayram; Bahman Hekmatshoar; Ning Li; John Ott; Devendra Sadana
• Keywords: Microelectronics; Flexible Electronics

Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged a wide range industries; from microelectronics to photovoltaics even solid state lighting. Historically, most attempts enable flexibility have focused on introduction new material systems that, so far, severely compromise performance compared state-of-the-art The few approaches that do attempt render contemporary high-performance materials rely layer transfer techniques complicated, expensive material-specific. In paper, we review method removing surface layers brittle substrates called Controlled Spalling Technology allows one simple peel or device their host substrate <i>after</i> they been fabricated. This fabricate electronic products manner choosing, make them afterwards. technique is simple, inexpensive largely independent size. We demonstrate power generality by application number disparate applications including integrated circuits, high-efficiency GaN-based