Kinetics of Curing of Epoxy Oligomer by Diaminodiphenyl Sulfone: Rheology and Calorimetry

• DOI: 10.1134/s0965545x18050012
• Publication Date: 2018-09-03T14:24:22Z
• Authors: M. P. Arinina; V. A. Kostenko; I. Yu. Gorbunova; S. O. Il’in; A. Ya. Malkin
• Keywords: 02 engineering and technology; 0210 nano-technology

Diaminodiphenyl sulfone is used as a curing agent to obtain an epoxy-resin-based binder with improved thermal stability. The kinetics of curing of this composition is studied by rheokinetic and calorimetric methods. It is shown that complete conversion is attained at a temperature of 200°С or higher. The rate of viscosity increase in the course of time in curing under flow conditions does not depend on the shear rate; the viscosity changes monotonically. The curing reaction occurs in the homogeneous mode without separation of a crosslinked polymer; it is described by a second-order equation with self-deceleration at low temperatures. The rheokinetic characteristics and temperature dependences of kinetic parameters of the process are determined.