Low Power and High Density Optical Interconnects for Future Supercomputers
Power density
DOI:
10.1364/ofc.2010.othx2
Publication Date:
2013-04-12T21:20:02Z
AUTHORS (9)
ABSTRACT
Increasing performance in supercomputers requires a concomitant increase intra-system interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board chip level interconnects.
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