A 25-Gbps×4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on- Si for On-Board Optics

• DOI: 10.1364/ofc.2019.tu2i.1
• Publication Date: 2019-02-25T15:58:28Z
• Authors: Toshiki Kishi; Hitoshi Wakita; Kota Shikama; Munehiko Nagatani; Shigeru Kanazawa; Takuro Fujii; Hidetaka Nishi; Hiroshi Ishikawa; Yuko Kawajiri; Atsushi Aratake; Hideyuki Nosaka; Hiroshi Fukuda; Shinji Matsuo

A 4-channel wire-bond-free 3D-stacked transmitter module consisting of a 65-nm CMOS cascode shunt LD driver, 1.3-μm LD-array-on-Si, and LTCC interposer achieves simultaneous 4-channel 25-Gbps error-free transmission over 1.2-km-long SSMF, with power consumption of 2.67 mW/Gbps.