The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

• DOI: 10.1364/ofc.2023.tu3i.3
• Publication Date: 2023-05-18T14:00:07Z
• Authors: Maria Spyropoulou; Giannis Kanakis; Giorgos Brestas; Yuqing Jiao; Salim Abdi; Zhaowei Chen; Desalegn Feyisa W...; Ripalta Stabile; Nicola Calabretta; Kevin Williams; Virginie Nodjiadjim; Romain Hersent; Agnieszka Konczyk...; Muriel Riet; Richard Schatz; Oskars Ozolins; Xiaodan Pang; Mahdieh Joharifar; Jakub Zvěřina; Martin Žoldák; Boaz Atias; Paraskevas Bakopo...; Elad Mentovich; Hercules Avramopo...
• Keywords: Transceivers; optical modulation; Polymers; [SPI] Engineering Sciences [physics]; multiterabit datacenter; optical transceiver architecture; computer centres; electronics technologies; 7. Clean energy; Optical interconnections; [PHYS] Physics [physics]; optical fibre communication; optical transceivers; optical receivers; Thermal management of electronics; Optical switches; Optical fibers; Next generation networking; optical fibre networks; wavelength division multiplexing

We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.