3D Interconnects and III-v Semiconductor Plasma Etching for Low-Cost and High-Efficiency Photonic Devices
Plasma Etching
Semiconductor device fabrication
DOI:
10.1364/seled.2024.stu3g.3
Publication Date:
2025-03-22T03:55:24Z
AUTHORS (1)
ABSTRACT
Photonic chips require new processes to enable transitioning 3D interconnects. We fabricated interconnects on a multijunction solar cell. demonstrate photonic devices having areas 3 orders of magnitude smaller compared standard chips. Full-text article not available; see video presentation
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (0)
CITATIONS (0)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....