PARAMETRIC NUMERICAL STUDY OF THE FLOW AND HEAT TRANSFER IN A DIMPLED WAVY MICROCHANNEL

• DOI: 10.1615/heattransres.2015010726
• Publication Date: 2015-09-22T16:37:55Z
• Authors: Liang Gong; Hui Lu; Hongyan Li; Minghai Xu
• Keywords: Microchannel; Dimple; Electronics cooling

Thermal management of microchips and integrated circuits becomes a more serious problem, since the density transistors grows. In this paper, new microchannel cooling method, heat sink with dimples, is investigated respect to transfer flow resistance for electronics thermal management. Five types sink, viz. one smooth channel, wavy three channels were studied by numerical method. The sizes single module are all 1 mm × 20 mm; equivalent diameters channel inlet 500 µm; flux W/mm2 set on bottom kinds sink. simulation results show that dimples could break up boundary layer enhance convection, which improve performance