Thermal, adhesive and solvent bonding techniques for polymer and polymer-glass microchip device fabrication

• DOI: 10.18358/np-26-2-i6474
• Publication Date: 2016-05-25T12:34:47Z
• Authors: T. A. Lukashenko; A. N. Tupik; ; G. E. Rudnitskaya; ; A. L. Bulyanitsa; ; ; A. I. Tsimbalov; ; A. A. Evstrapov
• Keywords: 0103 physical sciences; 01 natural sciences