Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

• DOI: 10.2139/ssrn.4608391
• Publication Date: 2023-10-20T15:20:33Z
• Authors: xi huang; liang zhang; min jia Zhang; Chen Chen; Xiao Lu; lei Sun

This study investigated the influence of three ultrasonic-assisted soldering process parameters, namely temperature, ultrasonic duration, and power, on strength Cu/Sn58Bi-0.4Mg/Cu solder joints. A three-factor, three-level orthogonal experiment was conducted by us using an L9 (34) design, research outcome evaluated in terms joints shear strength. The optimal experimental design determined through range analysis, Analysis Variance (ANOVA) performed to assess individual impacts each factor results. Furthermore, we employed scanning electron microscopy (SEM) examine microstructures joints, investigate progression intermetallic compounds (IMC), analyze fracture surface morphology. essential Energy Dispersive Spectroscopy (EDS) elemental analysis diffusion distribution elements. Finally, validation experiments were compare from with derived theoretical revealing that latter yielded superior has identified excellent set parameters for ultrasonically assisted bonding. It offers novel insights into parameter selection soldering, potential energy conservation efficiency improvement benefits.