Thermal Management of Integrated Circuits in Energy Systems: Flow Boiling in Microchannels with Multiple Ultra-High Heat Flux Sources

• DOI: 10.2139/ssrn.5079074
• Publication Date: 2025-01-01T15:36:49Z
• Authors: Bingcheng Li; Xianyi Wang; Nianqi Li; Lap Mou Tam; Min Zeng; Qiuwang Wang
• Keywords: Heat transfer enhancement

Efficient thermal management is crucial for high-power 3D integrated circuits due to ultra-high heat flux hotspots that threaten performance and reliability. This study employs numerical simulation integrating fluid-solid transfer the VOF model investigate flow boiling in microchannels under mass fluxes of 400–800 kg/(m²·s). A novel stochastic nucleation introduced address instabilities from sudden phase transitions, validated through experiments. micro-spiral scheme compared with square, circular, rounded square using energy efficiency metrics. Results reveal spiral demonstrate superior bubble dynamics, leveraging centrifugal forces stable liquid-vapor separation mitigating wall dry spots. design reduced junction temperatures by 4–6°C, enhanced "efficiency index" 43.9%, improved "area goodness factor" 28.6% channels. Spiral effectively regulated temperature gradients, limiting maximum difference 5.1°C resistance 0.00471°C/W, coefficient deviation below 1.8%. These findings highlight potential enhance performance, reduce resistance, improve efficiency, ensuring reliable operation 3DICs conditions.