PIP-II High Beta 650 Prototype Cryomodule Assembly Experience and Related Design Optimization

• DOI: 10.2172/2440010
• Publication Date: 2024-09-11T02:25:04Z
• Authors: J. Ozelis; M. Barba; J. Bernardini; C. Contreras-Mart...; D. Crawford; J. Dong; V. Grzelak; P. Hanlet; J. Holzbauer; Y. Jia; S. Kazakov; T. Khabiboulline; J. Makara; N. Patel; V. Patel; L. Pei; D. Peterson; Y. Pischalnikov; D. Porwisiak; S. Ranpariya; J. Steimel; N. Solyak; J. Subedi; A. Sukhanov; P. Varghese; T. Wallace; M. White; S. Wijethunga; Y. Xie; S. Yoon