Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

• DOI: 10.3390/electronicmat1010002
• Publication Date: 2020-08-31T02:00:17Z
• Authors: Lukas Rauter; Johanna Zikulnig; Taulant Sinani; Hubert Zangl; Lisa-Marie Faller
• Keywords: Tensile testing; Adhesive Bonding; Heat Resistance; Wire bonding

Different conductive bonding strategies for the hybrid integration of flexible, inkjet-printed electronics are investigated. The focus present work lies on providing a practical guide comprising standard techniques that inexpensive, easily implementable and frequently used. A sample set consisting identical test structures different paper plastic substrates was prepared using silver (Ag) nanoparticle ink. sintered specimens were electrically contacted soldering, adhesive crimping. Electrical mechanical characterization before after exposing samples to harsh environmental conditions performed evaluate reliability methods. Resistance measurements done connecting specimens. Afterwards, 85 °C/85% damp-heat tests tensile applied. Adhesive appears be most suitable versatile method, as it shows adequate stability all specimen substrates, especially exposure test. During testing, proved stable, forces up 12 N could exerted until breakage connection. As drawback, showed highest increase in electrical resistance among strategies.