Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints

• DOI: 10.3390/ma17092004
• Publication Date: 2024-04-25T12:08:32Z
• Authors: Dinh-Phuc Tran; Yu-Ting Liu; Chih Chen
• Keywords: Void (composites); Liquid phase; Mass fraction; Fraction (chemistry); Shear Strength; Thermal Treatment

The effects of the sintering duration and powder fraction (Ag-coated Cu/SnAgCu) on microstructure reliability transient liquid phase sintered (TLPS) joints are investigated. results show that two main intermetallic compounds (IMCs, Cu6Sn5 Cu3Sn) formed in joints. ratio generally decreased with increasing time, Cu fraction, thermal treatment. void high-Cu-fraction increased stressing durations, respectively, whereas low-Cu-fraction counterparts were stable. We also found shear strength treatment which resulted from transformation Cu3Sn. Such findings could provide valuable information for optimizing TLPS process assuring high electronic devices.