Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

• DOI: 10.3390/polym13010147
• Publication Date: 2021-01-02T03:35:48Z
• Authors: William Anderson ...; Chen-Yang Huang; Jian-Xun Chen; Yu-Chian Soong; Ying-Nan Chan; Kuo-Chan Chiou; Tzong-Ming Lee; Chih-Chia Cheng; Chih-Wei Chiu
• Keywords: aluminum oxide; boron nitride; underfill encapsulation; hybrid filler; thermal conductivity; 02 engineering and technology; coefficient of thermal expansion; 0210 nano-technology; 7. Clean energy; Article

In this study, a thermal conductivity of 0.22 W·m-1·K-1 was obtained for pristine epoxy (EP), and the impact hybrid filler composed two-dimensional (2D) flake-like boron nitride (BN) zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on resin investigated. With 80 wt.% Al2O3-BN contents, EP composite reached 1.72 W·m-1·K-1, increasing approximately 7.8-fold with respect to pure matrix. Furthermore, different important properties application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient expansion (CTE), glass transition temperature (Tg), decomposition (Td), dielectric properties, images. The performance is suitable specific electronic applications flip-chip underfill packaging.