Impact of Curing Time and Temperature on Bond Performance of Epoxy Resin Adhesives for Steel Bridge Decks

• DOI: 10.3390/polym17081018
• Publication Date: 2025-04-09T16:05:56Z
• Authors: Chuanbin Fan; Huanyong Chen; Feng Lin; Weixiong Li; Xuetang Xiong; Bo Chen; Huayang Yu
• Keywords: Epoxy adhesive; Bonding strength

The bonding performance of epoxy resin adhesives plays a critical role in ensuring interlayer adhesion and long-term durability steel bridge deck pavements. However, the construction environment temperature curing time significantly influence properties adhesives. To address this issue, systematic evaluations tack-free were conducted. results demonstrate that under identical durations, tensile bond strength between layer plate increases with higher temperatures. Similarly, at constant temperatures, extended times lead to improved strength. Both temperatures longer durations reduce adhesive. Under natural outdoor conditions, adhesive achieves design requirements for both after 48 h curing, optimal workability. Conversely, prolonged beyond 72 reduced while maintaining acceptable time. For ambient duration is determined be 48~72 h, balancing (preventing equipment). This research offers technical guidance field pavement on decks by establishing protocols ensure reliable