Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components

• DOI: 10.3390/pr11072052
• Publication Date: 2023-07-10T04:54:23Z
• Authors: Yuxuan Jiang; Min Zhao; Litao Zhao; Qin Chen; Qing Huang; Xiaolong Song; Chenglong Zhang; Jingwei Wang
• Keywords: Mobile phone; Shields

Dismantling the waste printed circuit boards (WPCBs) of obsolete mobile phones is essential for resource recycling and environmental protection. An automated WPCB disassembly equipment based on hot-vibration process was designed applied, with optimized conditions a heating temperature 250 °C an amplitude >3.66 mm. The dismantling rate electronic components metal shields 98%, but underfill less effective. Both simulation actual measurement results equipment’s thermal field showed that inside bin uniform, maximum difference 6–8 °C. area low-temperature region accounted approximately 5% total area. acceleration ranged from 2.11 to 8.28 g when using force model. This can be applied disassemble large quantities WPCBs.