Design and Fabrication on the Electroplating Polishing Pad with Phyllotactic Pattern

• DOI: 10.4028/www.scientific.net/amr.472-475.2568
• Publication Date: 2012-02-27T13:56:57Z
• Authors: Yu Shan Lu; Zhi Hui Kou; Jun Wang; Cheng Yi Zhao
• Keywords: 0202 electrical engineering, electronic engineering, information engineering; 02 engineering and technology

The surface texture of polishing pad is a key factor which determines the performance of polishing pad, and by altering the geometrical pattern of polishing pad surface, the surface texture of polished workpiece can be improved. In this paper, based on phyllotaxis theory in biology, the polishing pad with phyllotactic pattern has been designed and the effects of phyllotactic parameters on the surface texture of polishing pad have been discussed. Lastly, the polishing pads with phyllotactic pattern have been made with lithography and composite plating technology, and the influence of correlative plating parameters on plated coating have been investigated. The results indicated that the abrasive grain block density increase with the increasing of the diameter D of abrasive grain block and the decreasing of phyllotactic coefficient k, and the quality of electroplating is optimal when current density is 1A/dm2 and temperature is 30°C.