Finite Element Simulation of Precision Cutting Monocrystalline Silicon

• DOI: 10.4028/www.scientific.net/amr.662.99
• Publication Date: 2013-03-11T17:09:49Z
• Authors: Li Qiu Shi; Xiao Wen Li; Feng Yu
• Keywords: Rake angle; Brittleness; Rake; Cutting tool

Monocrystalline silicon is typical of hard brittle materials, a high surface quality can be obtained in ductile-regime cutting. The success the turning process depends on optimizing machining parameters such as tool edge radius, rake angles, depth cut and cutting speed, etc. In this study, based ductile–brittle transition mechanism, optimization were determined with commercial, general purpose FEA software Msc.Marc. result demonstrates that value temperature minimum when angle range -15º～-30º. Smaller radius was selected while maintaining life. As long beyond speed 6 ~ 8 mm/s, smaller residual stress obtain.