Metallization of AlN for Electronics

• DOI: 10.4028/www.scientific.net/ast.45.1594
• Publication Date: 2009-03-16T11:17:11Z
• Authors: Hiroki Yokoyama
• Keywords: 02 engineering and technology; 0210 nano-technology

Aluminum nitride (AlN) is widely used in the field of electronics because it has high thermal conductivity, good electric and mechanical properties. On other hand a shortcoming being difficult to wet metals. Therefore, various contrivances are needed form metal film with adhesion strength on AlN surface. In this paper we will review vacuum technology that been up now, mention middle thickness printing method be key from now on. Adhesion mechanism interface between also reported.