Materials and Process Study for Polymer Hybrid Bonding

• DOI: 10.4071/001c.129737
• Publication Date: 2025-02-17T16:20:23Z
• Authors: Masaya Jukei; Kota Nomura; Yugo Tanigaki; Takenori Fujiwara; Hitoshi Araki; Tomoyuki Honda; Yu Shoji
• Keywords: Chemical Mechanical Planarization

Low-temperature curable polyimides with minimal device damage have been developed for 3D stacking organic hybrid bonding technology. We confirmed showed significant polishing rates alkaline slurry. Polyimide-to-polyimide and polyimide/copper at a low-temperature annealing were successfully demonstrated. Furthermore, polyimide-to-polyimide mechanisms investigated from the chemical physical aspects of material, respectively. Moreover, polymer copper protrusion test vehicles was polished Chemical Mechanical Polishing, which good copper-to-copper joints. Finally, it that they could maintain insulation reliabilities after accelerated tests.