Comparison of Measured and Modeled Lithographic Process Capabilities for 2.5D and 3D Applications Using a Step and Repeat Camera

• DOI: 10.4071/isom-tp11
• Publication Date: 2015-10-21T20:05:27Z
• Authors: James Webb; Roger McCleary; Gerald Lopez; Qing Tan
• Keywords: Stepper; Reticle; Optical proximity correction; Photomask

Increasing volume using larger substrates with decreasing process margins create new challenges for advanced packaging applications. Key step and repeat camera technology continues being introduced the mass production of high density interconnects used 2.5D 3D technologies that will provide solutions encountered. A 2X reduction stepper unique features achieves tighter specifications needed many applications printed on large substrates. field-of-view optical projection system utilizes 350–450nm light spectrum from a mercury arc to expose circuit patterns reticle mask onto substrate image optimal fidelity required technologies. The imaging field prints 52mm x 66mm area or 59.4mm in single exposure. These enable fewer shots which result higher throughput lower power. Details adjustments are provided extend range use both power discussed. An extensive evaluation measured modeled lithographic capabilities achieve critical dimensions precise placement is provided. Limiting resolution depth focus results sampled over be supported simulation. Results thin thick resist patterning presented compared simulated profiles MACK4 model.