A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test

• DOI: 10.4313/jkem.2016.29.3.152
• Publication Date: 2016-04-14T08:11:38Z
• Authors: Sang-Won Jung; Min-Soo Kang; Yu-Jae Jeon; Do-Seok Kim; Young-Eui Shin
• Keywords: Thermal shock; Shear Strength; Temperature cycling

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test (<TEX>$-40^{\circ}C{\sim}125^{\circ}C$</TEX>, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks verified, also shear strengths measured for degradation joints. In addition, stress distributions at analyzed to compare changes before after according by FEA (finite elements analysis). We considered effects IMCs As results, was occurred initial crack, crack propagations concentration solder-IMCs interface, when grown inside.