Assessment of Viscoplastic Deformation Behavior of Eutectic Solder and Lead-free Solder

• DOI: 10.6117/kmeps.2011.18.2.017
• Publication Date: 2011-01-01
• Authors: Bong‐Hee Lee; Jinwon Joo
• Keywords: Viscoplasticity

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal mind, shear specimen that was composed two metal bars having different coefficient expansion solder blocks placed between designed fabricated. Two types blocks, eutectic (Sn/36Pb/ 2Ag) lead-free (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns several steps recorded analyzed three cycles using real-time moir setup. The data verified with FEA used to evaluate suitability numerous constitutive models available literatures. employing Anand material model suggested by Darveaux et al. Chang found be excellent agreement results solder, respectively. In addition, numerical predictions on bending displacement, strain viscoplastic distortion energy are documented compared.