Enhancement-mode Ga2O3 MOSFETs with Si-ion-implanted source and drain

Equivalent series resistance Drain-induced barrier lowering
DOI: 10.7567/apex.10.041101 Publication Date: 2017-03-07T09:14:23Z
ABSTRACT
Enhancement-mode β-Ga2O3 metal–oxide–semiconductor field-effect transistors with low series resistance were achieved by Si-ion implantation doping of the source/drain contacts and access regions. An unintentionally doped Ga2O3 channel background carrier concentration that was fully depleted at a gate bias 0 V gave rise to positive threshold voltage without additional constraints on dimensions or device architecture. Transistors length 4 µm delivered maximum drain current density (IDS) 1.4 mA/mm an IDS on/off ratio near 106. Nonidealities associated Al2O3 dielectric as well their impact enhancement-mode performance are discussed.
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