In this paper, the crosstalk effects in both small and large diameter multiwalled carbon nanotube bundle interconnects (MWCNTs) for future nanoscale integrated circuits are studied with help of ABCD parameter matrix approach global levels at 22- 14-nm technology nodes. Here, isolated MWCNTs modeled using an equivalent single conductor transmission line. The simulation results show that par result SPICE model. It is observed performance wise, MWCNT bundles better than copper wire repeated...

Internet of Things (IoT) is an emerging technology where each and every 'thing' possible to be connected through a network also controllable from any remote station. Coming few years, IoT going unavoidable part our daily lives. Every sector like manufacturing farms, traffic controls, real-time environment monitoring, security systems, health-care, e-agriculture etc. Is governed by as backbone. Ensuring during this voluminous information exchange becomes critical issue in context. It applies...

In several modern applications, data are generated continuously over time, such as from smartwatches. We assume collected and analyzed sequentially, in batches. Since traditional or offline methods can be extremely slow, Ghosh et al. (2025) proposed an online method for Bayesian model averaging (BMA). Inspired by the literature on renewable estimation, they developed generalized linear models (GLMs) that reduces storage computational demands dramatically compared to BMA. The of works very...

Wireless sensor networks (WSNs) have witnessed advancement in medical services from real-time tracking and computer-assisted machine to alert response systems. Due a tremendous shortage of trained manpower huge cost for setting up state-of-the-art facilities, it is often not possible deliver proper health care the rural remote areas. Lack accurate timely information further adds complexity challenges problem. The proposed system uses three-tier architecture that can be generally applied WSN...

The high density of interconnects, closer proximity modules, and routing phase are pivotal during the layout a performance-centric three-dimensional integrated circuit (3D IC). Heuristic-based approaches typically used to handle such NP-complete problems global in 3D ICs. To overcome inherent limitations deterministic approaches, novel methodology for multi-objective based on fuzzy logic has been proposed this article. guiding information generated after placement is with help expert system...

With the tremendous growth in VLSI technology recent years, Integration density of transistors has reached billions causing scaling to touch subatomic dimension deep submicron regime where laws classical physics can not survive. Due inherent information loss and other factors associated with irreversible computing, reversible circuits are becoming more important terms computing for present future days. However, due several factors, known synthesis approaches Boolean logic like Karnaugh Map...

Achieving lightning fast speed data communication in Chip Multi Processor (CMP) based systems as well Networkon Chips (NoCs) is always desired for target performance. Data links inside the fabric of CMP or NoC architectures have strong impact on their performance and power dissipation. Several approaches exist to reduce dissipation parallel link on-chip interconnects, a very few techniques are reported reduction serial links. The existing serial-link don't necessarily account correlation...

Internet of Things is an emerging technology having the ability to change way we live. In IoT vision, each and every 'thing' has talking other that brings idea Everything in reality. Numerous services can make our daily life easier, smarter, even safer. Using designing some special a lifesaver system. this paper, have presented enabled approach provide emergency communication location tracking remote car meets unfortunate accident or any situation. Immediately after emergency, system either...

Due to the limitations of traditional bus based systems, Network-on-Chip (NoC) has evolved as most dominanttechnology in paradigm communication-centric revolution, where, besides computation, inter-communication between cores is an indispensable aspect a SoC. Furthermore, emergence three dimensional integrated circuits (3D-ICs) resulted better performance, functionality, and packaging density compared planar ICs. The amalgamation these two technologies, 3D NoC architecture, can combine...

In deep sub-micron regime, interconnect delays dominate VLSI circuit design. Thus, construction of cost-effective global routing trees is key to such designs. order reduce the delay, traditional Manhattan (M-) architectures are currently being replaced by diagonal X architectures. A recent architecture based on Y interconnects, involving pervasive use 0deg, 60deg, and 120deg oriented semi-global wirings. Unlike X-routing, Y-routing Is observed support regular grid, which as important for...

In high-performance VLSI circuits, the on-chip power densities are playing dominant role due to increased scaling of technology, increasing number components, frequency and bandwidth. The consumed is usually converted into dissipated heat, affecting performance reliability a chip. this paper, we consider placement standard cells gate arrays (modules) under thermal considerations. Our contributions include: (i) an algorithm for optimal gates or minimize possible occurrence hot spots, (ii)...

Dominance of on-chip power densities has become a critical design constraint in high-performance VLSI design. This is primarily due to increased technology scaling, number components, frequency and bandwidth. The consumed usually converted into dissipated heat, affecting the performance reliability chip. Moreover, recent trends entail stacking multiple active (device) layers monolithic These 3D chips have significantly larger than their 2D counterparts. In this paper, we consider thermal...

Single-walled carbon nanotubes (SWCNTs) have the potential to revolutionize interconnects in future nanoscale integrated circuits. In proposed work, crosstalk effects are investigated SWCNTs at 21 nm and 15 technology nodes for intermediate as well global interconnects. An ABCD parameter based approach has been used investigate delay noise both sparse dense SWCNT bundled interconnect system. It is evident from simulation results that model not only 100% accurate but also almost 10 times...

Since its inception, DNA computing has advanced to offer an extremely powerful, energy-efficient emerging technology for solving hard computational problems with inherent massive parallelism and high data density. This would be much more powerful general purpose when combined other existing well-known algorithmic solutions that exist conventional architectures using a suitable ALU. Thus, specifically designed Arithmetic Logic Unit (ALU) can address operations both domains mitigate the gap...