A5064993003- Corrosion Behavior and Inhibition
- High-Temperature Coating Behaviors
- Metallurgical Processes and Thermodynamics
- Electronic Packaging and Soldering Technologies
- Metal Alloys Wear and Properties
- Microstructure and Mechanical Properties of Steels
- Aluminum Alloy Microstructure Properties
- Surface Roughness and Optical Measurements
- Hydrogen embrittlement and corrosion behaviors in metals
- Blood groups and transfusion
- Parvovirus B19 Infection Studies
- Metal and Thin Film Mechanics
- Concrete Corrosion and Durability
- Materials Engineering and Processing
- Material Selection and Properties
- Thermal and Kinetic Analysis
- Surface Modification and Superhydrophobicity
- nanoparticles nucleation surface interactions
- Injection Molding Process and Properties
- Thermodynamic and Structural Properties of Metals and Alloys
- Mechanical Behavior of Composites
- Cytomegalovirus and herpesvirus research
- Advanced Welding Techniques Analysis
Hyundai Steel (South Korea)
2020
Keimyung University Dongsan Medical Center
2018
Keimyung University
2018
Korea University
2009-2017
McMaster University
2016
In this study, Sn-Ag nano solders of three different compositions (Sn-1.0 mass%Ag, Sn-3.5 mass%Ag and Sn-6.5 mass%Ag) were synthesized via arc-discharge process. The properties analyzed using X-ray Diffraction (XRD), Transmission Electron Microscopy (TEM), Scanning (SEM), Energy Dispersive spectroscopy (EDX), Differential Calorimetry (DSC). Particle size relatively widely ranged from 10 nm to 340 nm. For Sn-1.0 average was 200∼240 nm, that for 40∼50 with some extra-ordinary large particles...
Cytomegalovirus (CMV) causes severe diseases in premature infants and immunocompromised hosts, antiviral therapy is often required for disease control. However, the clinical manifestations treatment courses CMV-associated thrombocytopenia immunocompetent children are unclear.Medical records of who suffered from thrombocytopenia, showed positive CMV polymerase chain reaction CMV-like symptoms were retrospectively analyzed at three university hospitals Daegu January 2000 to March 2017....
In the electronic components and device packaging process, Cu conductor surface is generally coated with Au Ni. The coating applied to prevent oxidation of enhance solderability, while Ni as a diffusion barrier between solder alloy substrate, in order restrict formation growth intermetallic compounds. dynamic reactive wetting characteristics Sn-Ag-Cu alloys are related properties materials. present study, behavior on substrates was firstly investigated millisecond scale. On bare surface,...