Jaesik Lee

ORCID: 0000-0001-5514-4595
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About
Contact & Profiles
Research Areas
  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Dental Trauma and Treatments
  • dental development and anomalies
  • Integrated Circuits and Semiconductor Failure Analysis
  • Electrostatic Discharge in Electronics
  • Analog and Mixed-Signal Circuit Design
  • Semiconductor materials and devices
  • Electromagnetic Compatibility and Noise Suppression
  • Photonic and Optical Devices
  • Oral and Maxillofacial Pathology
  • Endodontics and Root Canal Treatments
  • Advancements in PLL and VCO Technologies
  • Dental materials and restorations
  • Innovation in Digital Healthcare Systems
  • Radio Frequency Integrated Circuit Design
  • User Authentication and Security Systems
  • Maritime Navigation and Safety
  • Dental Research and COVID-19
  • Dental Radiography and Imaging
  • RFID technology advancements
  • Advancements in Semiconductor Devices and Circuit Design
  • Technology and Data Analysis
  • Dental Implant Techniques and Outcomes
  • Human-Automation Interaction and Safety

Kyungpook National University
2017-2024

Hyejeon College
2014-2018

Korea University
2018

Nvidia (United States)
2018

Sapporo Medical University
2015-2017

Qualcomm (United Kingdom)
2015-2016

Qualcomm (United States)
2015

National Information Society Agency
2007-2015

Soongsil University
2009-2013

Navitas Systems (United States)
2013

This study aims to determine the influential factors on market share of electric vehicles through panel data analysis based time series from 2011 2015 in 31 countries. We selected five significant independent variables that are expected affect vehicle adoption literature review. The econometric model this suggests relative price compared internal combustion engine vehicle, driving range, and number models available markets correlated vehicles. On other hand, relationship between recharging...

10.3390/su9101783 article EN Sustainability 2017-10-01

Polyetheretherketone (PEEK) crowns offer a provisional option for esthetic restorations in pediatric patients. PEEK has mechanical properties similar to dentin but exhibits low bond strength with luting cements. This study aimed evaluate the effect of different surface treatments on between and four cements by measuring shear (SBS). Sixty specimens were divided into three treatment groups: control, sandblast, 98% sulfuric acid, further cement subgroups: methyl methacrylate (MMA)-based resin...

10.5933/jkapd.2025.52.1.89 article EN THE JOURNAL OF THE KOREAN ACADEMY OF PEDTATRIC DENTISTRY 2025-02-24

Antibiotic use in the dental field, especially pediatric dentistry, should be carefully considered, taking into account resistance and side effects. This review aims to provide a general overview of antibiotic dosage dentistry. Indications for prescription include symptoms systemic infection such as fever (≥ 38°C), lymphadenitis (cervical lymph node swelling tenderness), facial (especially spreading around eyes), cellulitis, soft tissue infections (risk deep sepsis), severe localized or high...

10.5933/jkapd.2025.52.1.1 article EN THE JOURNAL OF THE KOREAN ACADEMY OF PEDTATRIC DENTISTRY 2025-02-24

A 5-b flash A/D converter (ADC) is developed in an 0.18-/spl mu/m SiGe BiCMOS that supports sampling rates of 10 Gsample/s. The ADC optimized to operate digital equalizers for 10-Gb/s optical receivers, where the has deliver over three effective number bits (ENOBs) at Nyquist. fully differential incorporating a wide-band track-and-hold amplifier (THA), resistive ladder, interpolation technique, and high-speed comparator design derived resolve aperture jitter metastability error. achieves...

10.1109/jssc.2004.833555 article EN IEEE Journal of Solid-State Circuits 2004-09-28

In this paper, we present an innovative wireless battery management system (WBMS™)that addresses the issues of conventional BMS architecture. The WBMS™ adopts communication technologies based on a proprietary Wireless Battery Area Network (WiBaAN™) protocol [1]. consists multitude energy-autonomous micro-sensors mounted each cell, and master module that collects processes data from micro-sensors. WiBaAN™ defines syntax, semantics synchronization messages between sensors module. will enable...

10.1109/evs.2013.6914889 article EN 2013-11-01

In addition to the primary symptoms arising from inflamed joints, muscle weakness is prominent and frequent in patients with rheumatoid arthritis (RA). Here, we investigated mechanisms of arthritis-induced dysfunction rats adjuvant-induced (AIA).AIA was induced knees by injection complete Freund's adjuvant allowed develop for 21 days. Muscle contractile function assessed isolated extensor digitorum longus (EDL) muscles. To assess underlying dysfunction, measured redox modifications, enzymes...

10.1186/s13395-015-0045-7 article EN cc-by Skeletal Muscle 2015-07-08

Patients with pulmonary hypertension (PH) suffer from inspiratory insufficiency, which has been associated intrinsic contractile dysfunction in diaphragm muscle. Here, we examined the role of redox stress PH-induced weakness by using novel antioxidant, EUK-134. Male Wistar rats were randomly divided into control (CNT), CNT + EUK-134 (CNT EUK), monocrotaline-induced PH (PH), and EUK groups. was induced a single intraperitoneal injection monocrotaline (60 mg/kg body weight). (3 weight/day),...

10.1371/journal.pone.0169146 article EN cc-by PLoS ONE 2017-02-02

This work presents an actively sampled photonic arbitrary waveform generator based on differential lithium-niobate electrooptic modulators. Ultralow timing jitter 1550-nm mode-locked laser time samples three serially connected Mach-Zehnder modulators, which are driven by six 12.5-Gb/s signals. equivalent of digital-to-analog converter allows for synthesis high-quality waveforms (>30-dB spurious-free dynamic range) over Nyquist bandwidth without loss performance.

10.1109/lpt.2005.859551 article EN IEEE Photonics Technology Letters 2005-11-22

Data intensive applications such as high performance computing (HPC) and artificial intelligence (AI) have recently become major subjects in industry. The heterogeneous integration of a chip bandwidth memories (HBMs) using through silicon via (TSV) based interposer has gained attractions to meet their requirements. An introduction micro bump systems these components (ex, reticle limited GPU HBMs) can created challenges on wafer (COW) stacking. impacts giant COW stacking process are...

10.1109/ectc.2018.00096 article EN 2018-05-01

Artificial intelligence (AI) technology has recently been introduced to dentistry. AI-assisted cephalometric analysis is one of its applications, and several commercial AI services have already launched. However, the performance these still unclear. This study aimed determine whether commercially available can replace manual by human examiners. Eighty-four pretreatment lateral cephalograms were traced examined two orthodontists four AIs, 13 commonly used variables calculated. Then,...

10.22514/jocpd.2023.085 article EN Journal of Clinical Pediatric Dentistry 2023-01-01

At the current technology level, a human examiner's review must be accompanied to compensate for insufficient commercial artificial intelligence (AI) performance. This study aimed investigate effects of expertise on efficacy AI analysis, including time-saving and error reduction. Eighty-four pretreatment cephalograms were randomly selected this study. First, examiners (one beginner two regular examiners) manually detected 15 cephalometric landmarks measured required time. Subsequently,...

10.22514/jocpd.2023.087 article EN Journal of Clinical Pediatric Dentistry 2023-01-01

Electrostatic discharge (ESD) accounts for over 30% of chip failure which occurred during manufacturing. Inadvertent touching by human body or contact with assembler tray can lead to such ESD failures. The most dominant model is the charged-device (CDM) wherein energy-destructive incorporated resulting from rapid inflow, outflow, high current. Conventional modeling and simulations CDM are engineered describe behavior protection circuits, hence have a limitation account chip-level charge...

10.1109/tcad.2002.805720 article EN IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2003-01-01

This paper presents a 6-b 12-GSample/s track-and-hold amplifier (THA) fabricated in an InP-InGaAs-InP double heterojunction bipolar transistor (DHBT) technology. The THA is intended for the front end of high-speed analog-to-digital converter digital-based electronic polarization-mode dispersion compensation circuit 10-Gb/s optical receiver. With switched emitter follower and clocked track-to-hold transition operation, it shows signal bandwidth over 14 GHz features total harmonic distortion...

10.1109/jssc.2003.815926 article EN IEEE Journal of Solid-State Circuits 2003-09-01

A 10-GBd 40-Gb/s coherent optical transport is a promising technology for higher data rate communications by virtue of improved sensitivity and high spectrum efficiency. One the major challenges in designing quadrature-phase-shift-keying receiver to achieve high-speed conversion at around 20-GHz sampling with least 5-bit resolution. With detailed design framework target requirements, this paper presents 20-GS/s flash analog-to-digital converter (ADC) realized 0.18-m SiGe BiCMOS technology....

10.1109/tcsi.2010.2048678 article EN IEEE Transactions on Circuits and Systems I Regular Papers 2010-06-03

We address package-induced degradation of BEOL interconnects and approaches for recovery. For dielectrics, we cover process options position in stack ULK films how these lead to differences strength. Experiments were designed cross-compare multiple methods test susceptibility interconnect CPI damage. also Chip Package Interaction changes as features layout evolve.

10.1109/irps.2012.6241788 article EN 2022 IEEE International Reliability Physics Symposium (IRPS) 2012-04-01

The feasibility of electroless Ni plating to compensate the Cu bump height variation in Cu-Cu 3-D packaging was investigated. After fabricating pillar and micro-stud structure on top bottom chips, respectively, thermocompression bonding then were sequentially carried out evaluated using dies shear force, daisy chain resistance, microstructure. It is found that parameter optimization Ar plasma surface cleaning increased bond strength. can for 1.9 μm a chip with filling gap between Cu-pillar...

10.1109/tcpmt.2011.2177269 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2012-03-05

This study analyzed the longevity of preformed metal crowns (PMCs) in first permanent molars and evaluated factors influencing their survival during a long-term follow-up period. In all, 115 treated with PMCs between June 2008 2018 were retrospectively analyzed. The overall combined success rate for group was 84.3%. 5-year 82.8%. Multivariate Cox regression analyses identified distal cavities mandibular PMC placement as risk restoration failure. Careful at final try-in stage augments crown.

10.5933/jkapd.2020.47.2.140 article EN THE JOURNAL OF THE KOREAN ACADEMY OF PEDTATRIC DENTISTRY 2020-05-31

This study aimed to evaluate the needs of dentists, dental technicians, hygienists, and dental-related workers in terms computer-aided design (CAD) software artificial intelligence (AI). Based on a factor analysis, 57 survey items were assigned six categories: (a) considerations when purchasing CAD software; (b) prosthesis process; (c) function; (d) use AI crown denture design; (e) impact AI; (f) improvements features. Overall, 93 participants included study, reliability resultant data was...

10.3390/app13052803 article EN cc-by Applied Sciences 2023-02-22

The building blocks of the 3-D IC integration technology are Through-Silicon Via (TSV) fabrication/implementation, thin wafer handling, low-temperature backside TSV revealing process, and electrical redistribution or connection vertical circuitry ICs. Of these elements, scheme for thinning passivation is a crucial element 3D integration. In this paper, novel via application proposed with newly developed process Si/Cu CMP applied to overcome practical limitations on uniformity originated from...

10.1109/ectc.2011.5898694 article EN 2011-05-01

This paper reports the first demonstration of drop-test reliability performance large, ultra-thin glass BGA packages that are directly mounted onto system board, unlike current approach flip-chip assembly interposers, involving additional organic which then SMT assembled boards. The packages, 18.4mm × in size made 100μm-thick glass, were also successfully assembled, for time, a line. effect on drop BGAs with circumferential polymer collars was studied extensively. While met requirements,...

10.1109/ectc.2015.7159806 article EN 2015-05-01

The complications of replacement resorption following tooth injury in growing children include infrapositioning the tooth, tilting adjacent teeth, and alveolar ridge deformity.Decoronation is a conservative treatment method that facilitates bone preservation.The current case report focuses on long-term preservation dimension decoronation three patients.Decoronation was performed prior to occurrence pubertal growth spurt, patients' width vertical apposition were monitored for at least 4...

10.22514/jocpd.2024.023 article EN Journal of Clinical Pediatric Dentistry 2024-01-01

Embedded Wafer Level Package (eWLP) is designed and developed. The eWLP consists of one silicon die encapsulated with a mold compound its size 12mm × 0.2mm. assembly process reconfiguration the dies on an adhesive tape, followed by molding, thinning rerouting distribution layer (RDL) process. Finite Element Modeling (FEM) used to understand stress in provide design input configuration eWLP. passed 1000 air-to-air thermal cycles (-40 125°C), unbiased Highly Accelerated Stress Test (HAST)...

10.1109/eptc.2010.5702696 article EN 2010-12-01
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