I. Gorelov
- Particle physics theoretical and experimental studies
- High-Energy Particle Collisions Research
- Quantum Chromodynamics and Particle Interactions
- Particle Detector Development and Performance
- Dark Matter and Cosmic Phenomena
- Neutrino Physics Research
- Computational Physics and Python Applications
- Cosmology and Gravitation Theories
- Black Holes and Theoretical Physics
- Particle Accelerators and Free-Electron Lasers
- Radiation Detection and Scintillator Technologies
- Medical Imaging Techniques and Applications
- Atomic and Subatomic Physics Research
- Superconducting Materials and Applications
- Astrophysics and Cosmic Phenomena
- Nuclear physics research studies
- Distributed and Parallel Computing Systems
- CCD and CMOS Imaging Sensors
- Stochastic processes and statistical mechanics
- International Science and Diplomacy
- advanced mathematical theories
- Radiation Effects in Electronics
- Advancements in Semiconductor Devices and Circuit Design
- Advanced Data Storage Technologies
- Particle accelerators and beam dynamics
European Organization for Nuclear Research
2010-2025
Istituto Nazionale di Fisica Nucleare, Laboratori Nazionali di Frascati
2023-2025
Lomonosov Moscow State University
1986-2023
University of New Mexico
2014-2023
Universitat de Barcelona
2023
Central China Normal University
2017-2020
University of Chinese Academy of Sciences
2017-2020
Tsinghua University
2020
Peking University
2020
State Key Laboratory of Nuclear Physics and Technology
2020
The silicon pixel tracking system for the ATLAS experiment at Large Hadron Collider is described and performance requirements are summarized. Detailed descriptions of detector electronics sensors given. design, fabrication, assembly modules presented. Data obtained from test beams as well studies using cosmic rays also discussed.
The ATLAS collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing and vacuum pipe of Large Hadron Collider. extreme operating conditions at this location have necessitated development radiation hard sensor technologies front-end readout chip, called FE-I4. Planar sensors 3D been investigated to equip layer, prototype modules using FE-I4A fabricated characterized 120 GeV pions CERN SPS 4 positrons DESY, before after module...