Gang Dong

ORCID: 0000-0001-6557-2286
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About
Contact & Profiles
Research Areas
  • 3D IC and TSV technologies
  • Magnetic and transport properties of perovskites and related materials
  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • Low-power high-performance VLSI design
  • Advanced Condensed Matter Physics
  • Semiconductor materials and devices
  • VLSI and Analog Circuit Testing
  • VLSI and FPGA Design Techniques
  • Multiferroics and related materials
  • Robotic Mechanisms and Dynamics
  • High Entropy Alloys Studies
  • Mineral Processing and Grinding
  • Advanced Thermoelectric Materials and Devices
  • Piezoelectric Actuators and Control
  • Ferroelectric and Piezoelectric Materials
  • Power Systems Fault Detection
  • Rare-earth and actinide compounds
  • Microwave Engineering and Waveguides
  • Integrated Circuits and Semiconductor Failure Analysis
  • High voltage insulation and dielectric phenomena
  • Additive Manufacturing Materials and Processes
  • Copper Interconnects and Reliability
  • Dynamics and Control of Mechanical Systems
  • Advanced materials and composites

Xidian University
2016-2025

Tianjin University
2011-2023

Zhejiang University of Technology
2006-2021

Tonghua Normal University
2019-2021

Kunming University of Science and Technology
2018-2020

Kunming University
2019-2020

Inner Mongolia Agricultural University
2018

National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”
2015

Tianjin Vocational Institute
2015

University of Chinese Academy of Sciences
2014

The growing demand for reliable and efficient power transmission has necessitated innovative solutions line planning. Despite advancements in energy systems, planning faces challenges related to optimizing routes capacities while accommodating historical data variability forecasts. objective of the study is utilize massive mining techniques on survey designs enhance planning, improving efficiency reliability electrical grid reducing costs environmental impact. collects data, including load...

10.1177/14727978251318062 article EN other-oa Journal of Computational Methods in Sciences and Engineering 2025-02-06

10.1109/tcpmt.2025.3543693 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2025-01-01

Herein, high-density La<sub>0.7</sub>(Ca<sub>0.205</sub>Sr<sub>0.095</sub>)MnO<sub>3</sub>:<italic>x</italic>Ag<sub>2</sub>O composites (LCSMO:<italic>x</italic>A, 0.0 ≤ <italic>x</italic> 0.5) are successfully fabricated by using a combination of sol–gel and solid-state methods.

10.1039/d0tc03991h article EN Journal of Materials Chemistry C 2020-01-01

To investigate the thermal behavior of 3-D integrated circuits, long computational times are required for large-scale stacked chips with a complicated structure. In this paper, an equivalent anisotropic model is introduced to reduce time resulting from numerical integration. By introducing model, complex nature through-silicon via (TSV) structure can be overcome. Our algorithm not only considers TSV and orientation heat flux, but also influence coupling between TSVs. The finite-element...

10.1109/tcpmt.2019.2893323 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2019-01-22

This paper focuses on the type synthesis of two degree-of-freedom (2-DoF) rotational parallel mechanisms (RPMs) that would be applied as actuating inter-satellite link antenna. Based upon Lie group theory, steps are necessary to synthesize 2-DoF RPMs except describing continuous desired motions moving platform. They respectively generation required open-loop limbs between fixed base and platform definition assembly principles for these limbs. Firstly, all available displacement subgroups or...

10.1016/j.cja.2016.05.005 article EN cc-by-nc-nd Chinese Journal of Aeronautics 2016-10-22
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