- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Microfluidic and Capillary Electrophoresis Applications
- Mechanical and Optical Resonators
- Advancements in Semiconductor Devices and Circuit Design
- Photonic and Optical Devices
- Graphene research and applications
- Semiconductor materials and interfaces
- Advanced Surface Polishing Techniques
- Nanofabrication and Lithography Techniques
- Microfluidic and Bio-sensing Technologies
- Advanced Memory and Neural Computing
- Optical Network Technologies
- Advanced Photonic Communication Systems
CMC Microsystems (Canada)
2022
École de Technologie Supérieure
2018-2021
Indian Institute of Technology Bombay
2012
Charge storage capability of multilayer graphene (MLG) in floating gate flash memory structure is demonstrated. MLG sheets are considered for this purpose because the higher work function and density states compared to single layer (SLG) lower conductivity along c-axis. A window 6.8V 1 second programming obtained at ±18V program/erase voltage. Number electrons stored after 18V voltage calculated as 9.1 x 1012 cm-2 which than SLG, suggesting suitability multi level data devices.
Graphene with varying number of layers is explored as metal gate electrode in oxide semiconductor structure by inserting it between the dielectric (SiO2) and contact (TiN) results are compared TiN electrode. We demonstrate an effective work function tuning upto 0.5 eV graphene layers. Inclusion even 1-3 significantly improved reliability measured breakdown characteristics, charge to breakdown, interface state density. These improvements attributed impermeability for hence reduced metallic...
The integration of passive radio frequency (RF) components, such as resistors, capacitors, and inductors, requires a relatively large area on complementary metal-oxide-semiconductor chips, which is not cost-effective in developing optical receiver front-ends. This could be addressed by implementing RF components silicon photonics chips. In this letter, we present an on-chip low-pass filter coupled to integrated photodetector. letter demonstrates that analog processing can implemented...
We present the design and fabrication of an electrostatic side-drive micromotor that achieves fastest operating speed reported for a device fabricated using PolyMUMPS process. High-speed is obtained by optimizing geometric parameters rotor stator electrodes, employing techniques to reduce friction in various regions adopting multiple approaches enhance driving torque micromotor. The key geometrical are determined through analytical modelling, bypassing intensive computational methods....
Micro-opto-electro-mechanical systems (MOEMS)based mirrors with a suitable actuation range are often used for optical beam scanning applications.While several MOEMS scanners have been reported, they limitations respect to their of motion, field view, mass, size and fabrication cost.In this work, we present rotary micro-polygon scanner based on an electrostatic variable capacitance micromotor laser steering applications.The miniaturized consists hollow micro-polyhedron mirror base radius 200...
We demonstrate high-performance rotary electrostatic side-drive variable capacitance micromotors with high speed and driving torque. The are fabricated using the PolyMUMPS process fastest device can rotate at 8040 rpm. Micromotors a varying number of rotor stators poles were designed, characterized. Multiple techniques applied to enhance motive torque reduce friction presents in micromotor. diameter is 600 μm it supported by only four dimples/bearing 3.5 radius. These achieve record as well...
Abstract This technical note reports a rapid technique to post-process and assemble micro-components onto dies including released movable microstructures. The method is applied microelectromechanical systems (MEMS) chips that were fabricated using commercial process, PolyMUMPs from MEMSCAP. It allows the assembly of micro-polyhedron over micromotors ensures remain fully functional. micro-polyhedrons are laser ablation spin coated with thin layer SU-8, acting as bonding layer. Then, they...