A5102951283- Electronic Packaging and Soldering Technologies
- Metallurgical Processes and Thermodynamics
- Metallurgical and Alloy Processes
- Solidification and crystal growth phenomena
- Intermetallics and Advanced Alloy Properties
- Thermodynamic and Structural Properties of Metals and Alloys
- 3D IC and TSV technologies
- Surface Modification and Superhydrophobicity
- Iron and Steelmaking Processes
- Concrete and Cement Materials Research
- Electrical Contact Performance and Analysis
- Nanomaterials and Printing Technologies
- Aluminum Alloy Microstructure Properties
- Advanced materials and composites
- Magnetic Properties of Alloys
- Magnesium Oxide Properties and Applications
- Hydrogen embrittlement and corrosion behaviors in metals
- Adhesion, Friction, and Surface Interactions
- Additive Manufacturing Materials and Processes
University of Science and Technology Beijing
2019-2023
Surface roughness is an important factor that affects the wetting of molten metal on ceramics. The effect surface alumina substrate contact angle, diameter, drop height and tension lead was investigated in temperature range 923–1123 K. microstructure lead/substrate interface observed by SEM. free energy substrates calculated geometrical average method. When increased from 0.092 to 2.23 μm, gradually, ranging 13.356 39.998 mJ/m2. diameter droplets decreased 9.111 7.19 mm. 3.41 3.85 angle...
In order to determine the effect of Sb element on welding reliability Sn-Sb alloy solder, interfacial behavior alloys with different contents Cu substrate was investigated. The evolution process layers explained by analyzing microstructure and reaction thermodynamics Sn-xSb/Cu system. addition has a non-monotonic intermetallic compound layers. can inhibit diffusion into solder. 3 wt.% in reduces activation energy from 286.41 62 kJ/mol, which promotes reaction. 10 increases 686.73 inhibits...