Efficient adhesion of gold thin films on dielectric or semiconductor substrates is essential in applications and research within plasmonics, metamaterials, 2D materials, nanoelectronics. As a consequence the relentless downscaling nanoscience technology, thicknesses layer overlayer have reached tens nanometers, it unclear if our current understanding sufficient. In this report, we investigated how Cr Ti layers influence nanostructure 2-20 nm Au by means high-resolution electron microscopy,...

We report the detection of protein molecules with nanofabricated pores using resistive pulse sensing method. A 20-nm-thick silicon nitride membrane a pore measuring about 55nm in diameter separated an electrolyte cell into two compartments. Current spike trains were observed when bovine serum albumin (BSA) was added to negatively biased compartment. The magnitude spikes corresponded particles 7–9nm (the size BSA molecule) passing through pore. This suggests that current blockages caused by...

Nanofabricated pores in 20 nm-thick silicon nitride membranes were used to probe various protein analytes as well perform an antigen−antibody binding assay. A two-compartment electrochemical cell was separated by a single nanopore, 28 nm diameter. Adding proteins one compartment caused current perturbations the ion flowing through pore. These correlated with both charge and size of or protein−protein complex. The potential this nanotechnology for studying interactions is highlighted...

The inability to intraoperatively diagnose and eliminate microscopic residual tumors represents a significant challenge in cancer surgery. These microtumors cause lethal recurrence metastasis. Herein, we show crucial example of Raman imaging with gap-enhanced tags (GERTs) serve as robust platform for intraoperative detection eradication foci, which exist surgical margins, tumor invasion, multifocal spread. GERTs feature gold core–shell nanostructures, reporters embedding inside the interior...

Three-dimensional (3D) nanofabrication techniques are of paramount importance in nanoscience and nanotechnology because they prerequisites to realizing complex, compact, functional 3D nanodevices. Although several methods have been proposed developed recent years, it is still a formidable challenge achieve balance among resolution, accuracy, simplicity, adaptability. Here, we propose method based on electron-beam lithography using ice resists (iEBL) fabricate nanostructures by stacking...

The integration of power inductors is a roadblock in realizing highly miniaturized supply package (PSiP) and on chip. Inductors such systems are used for energy storage filtering, but they dominate size loss. This paper presents novel three-dimensional in-silicon through-silicon via (TSV) magnetic-core toroidal inductor PSiP. magnetic powder based core embedded into TSV air-core using casting method. unique design with hollow suspended windings enables complete filling microscale powders....

Electron beam (e-beam) lithography using polymer resists is an important technology that provides the spatial resolution needed for nanodevice fabrication. But it often desirable to pattern nonplanar structures on which polymeric cannot be reliably applied. Furthermore, fragile substrates, such as free-standing nanotubes or thin films, tolerate vigorous mechanical scrubbing procedures required remove all residual traces of resist. Here we demonstrate several examples where e-beam amorphous...

Abstract We report a fabrication technology for 3D air-core inductors small footprint and very-high-frequency power conversions. Our process is scalable highly generic fabricating with wide range of geometries core shapes. demonstrate spiral, solenoid, toroidal inductors, transformer inductor advanced that cannot be produced by wire winding technology. The are embedded in silicon substrate consist through-silicon vias suspended windings. fabricated 20 25 turns 280-350 μm heights on 4-16 mm 2...

Micro-coil magnetic stimulation of brain tissue presents new challenges for MEMS micro-coil probe fabrication. The main are threefold; (i) low coil resistance high power efficiency, (ii) leak current from the into in vitro experimental set-up, (iii) adaptive process technology because dynamic research area, which requires agile design changes. Taking on these challenges, we present a fabrication that has three features; multilayer resist lift-off to pattern up 1800-nm-thick metal films, and...

Electron-beam lithography (EBL) is the backbone technology for patterning nanostructures and manufacturing nanodevices. It involves processing handling synthetic resins in several steps, each requiring optimization dedicated instrumentation cleanroom environments. Here, we show that simple organic molecules, e.g. alcohols, condensed to form thin-films at low temperature demonstrate resist-like capabilities EBL applications beyond. The entire lithographic process takes place a single...

Using surface micromachining technology, we fabricated nanofluidic devices with channels down to 10 nm deep, 200 wide and up 8 cm long. We demonstrated that different materials, such as silicon nitride, polysilicon dioxide, combined variations of the fabrication procedure, could be used make both on glass substrates. Critical channel design parameters were also examined. With basis, integrated equivalent elements which are found micro total analysis (μTAS) chips for electrokinetic...

We report the successful application of a new approach, ice lithography (IL), to fabricate nanoscale devices. The entire IL process takes place inside modified scanning electron microscope (SEM), where vapor-deposited film water serves as resist for e-beam lithography, greatly simplifying and streamlining device fabrication. show that labile nanostructures such carbon nanotubes can be safely imaged in an SEM when coated ice. is patterned at high intensity mask lift-off without degradation...

Miniaturization of power supplies is required for future intelligent electronic systems, e.g., Internet-of-Things devices. Inductors play an essential role, and they are by far the most bulky expensive components in supplies. This paper presents a miniaturized microelectromechanical system (MEMS) inductor its performance very highfrequency (VHF) converter. The MEMS silicon-embedded air-core toroidal inductor, it constructed with through-silicon vias, suspended copper windings, silicon...

Microarray hybridization or antibody binding can be detected by many techniques, however, only a few are suitable for widespread use since of these detection techniques rely on bulky and expensive instruments. Here, we describe the usefulness simple inexpensive method based gold nanoparticle labeled antibodies visualized commercial, office desktop flatbed scanner. Scanning electron microscopy studies showed that signal from scanner was proportional to surface density bound antibody–gold...

Understanding the condensation of dimeric thiostannate(IV) [Sn2S6]4– to SnS2 is key importance for development solution processing advanced tin(IV) sulfide based electronic devices such as photovoltaics (e.g., Cu2ZnSnS4, CZTSSe) and thin-film transistors. Here, we report crystal structure tetraammonium trihydrate ((NH4)4Sn2S6·3H2O), which can be used a more environmentally friendly alternative hydrazinium analogue in processed devices, e.g., CZTSSe. Hirshfeld surface analysis shows that...

We describe the design of an instrument that can fully implement a new nanopatterning method called ice lithography, where is used as resist. Water vapor introduced into scanning electron microscope (SEM) vacuum chamber above sample cooled down to 110 K. The condenses, covering with amorphous layer ice. To form lift-off mask, removed by SEM beam (e-beam) guided e-beam lithography system. Without breaking vacuum, mask then transferred metal deposition metals are deposited sputtering. cold...

The feature size of patterns obtained by electron-beam lithography (EBL) depends critically on resist properties, beam parameters, development process, and instrument limitations. Frozen layers simple organic molecules such as n-alkanes behave negative-tone resists for EBL. With the unique advantage an in situ thermal treatment replacing chemical development, entire lithographic process can be performed within a single instrument, thus removing influence developers size. By using...

Two-photon lithography enables powerful nanoscale 3D printing. Unfortunately, it uses toxic photopolymers. We report a layer-by-layer digital process using condensed organic vapor thin films as the starting material. The focused electron beam to chemically cross-link low-toxicity ice ito solid and shares software CAD databases with industrial Guided by electron-matter-interaction simulations, we control cross-linking thickness between 250 nm 2 µm. prints contained up 500 layers, voxel size...

Ice lithography (IL) fabricates 2D and 3D patterns using electron-solid interaction principle. Herein, we report IL patterning of the negative tone metalorganic precursor. The precursor is condensed at 80 K. It then patterned a 5–20 keV electron beam. pattern thickness surface roughness increase with area dose. line linewidth also growing doses. XPS results show that tungsten bound to oxygen; metallic WC bonds are absent, which suggests hexacarbonyl contains oxidized embedded in carbon...