- Silicon Carbide Semiconductor Technologies
- Advanced DC-DC Converters
- Multilevel Inverters and Converters
- Microstructure and Mechanical Properties of Steels
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Metallurgy and Material Forming
- Polymer Nanocomposites and Properties
- Advanced Surface Polishing Techniques
- Advanced Battery Technologies Research
- Electrostatic Discharge in Electronics
- Microgrid Control and Optimization
- Electromagnetic Compatibility and Noise Suppression
- Mechanical stress and fatigue analysis
- Conducting polymers and applications
- Heat Transfer and Optimization
- Supercapacitor Materials and Fabrication
- Cellular and Composite Structures
- Concrete and Cement Materials Research
- HVDC Systems and Fault Protection
- GaN-based semiconductor devices and materials
- Metal Alloys Wear and Properties
- Advancements in Battery Materials
- Polymer crystallization and properties
- Metal Forming Simulation Techniques
Vrije Universiteit Brussel
2022-2024
Flanders Make (Belgium)
2023-2024
Isfahan University of Technology
2018-2023
Iran University of Science and Technology
2020-2021
Ferdowsi University of Mashhad
2011-2020
A high demand for green and eco-friendly triboelectric nanogenerators (TENGs) has multiplied the importance of their degradability biomedical applications. However, charge generation current TENGs is generally limited. In this research, a flexible TENG based on silk fibroin (SF) fibrous layer polycaprolactone (PCL)/graphene oxide (GO) was developed. Moreover, PCL/GO surface modified using various concentrations GO (0, 1.5, 3, 6, 9 wt%). We demonstrated that modification nanosheets...
Power electronics converters (PECs) are responsible for efficiently converting electrical energy between power generators, storage systems and consumers/loads.The PECs subjected to complicated loading factors throughout their operations and, thus, proven have issues regarding lifetime.Therefore, according the original equipment manufacturers suppliers, reliability of is a key priority in order be widely used accepted industries.In this context, review article aims provide comprehensive...
The paper presents a precise and efficient model of Double-Side Cooled (DSC) SiC MOSFET, which incorporates the dynamics both electrical thermal variables. It offers suitable computational complexity for simulating transients in complex power converters. objective is to define that enables multi-scale time simulations facilitates rapid converter design system-level tools such as Simulink. Additionally, aims achieve simulation accuracy comparable device-level models next generation MOSFETs....
In this paper, a new soft-switching bridgeless single-phase power factor correction (PFC) converter is presented and analyzed. Employing an auxiliary switch, the input current dead angle that main drawback of existing buck-type PFCs omitted, thus, (PF) improved, which contribution paper. Proposed PFC operates under discontinuous conduction mode (DCM) draws sinusoidal from supply inherently. All switches diodes are turned on off soft switching, leads to low switching losses elimination diode...
In this article, a new bridgeless (BL) buck-boost power factor correction (PFC) converter using pulsewidth modulation (PWM) control is presented. The introduced structure operates in discontinuous conduction mode (DCM) to achieve the sinusoidal form of input current inherently. proposed utilizes simple zero-voltage-transition (ZVT) circuit which auxiliary switch turned on and off under zero switching (ZCS) condition, main switches turn zero-voltage (ZVS). Moreover, all diodes are ZCS...
In this paper, a new soft-switching bridgeless single-phase power factor correction converter is introduced and analyzed. Employing an auxiliary flyback circuit, existing dead angle in the input current eliminated while softswitching achieved. The processes only small amount of output power. Therefore, conduction losses its bridge diode semiconductor devices are low. Also, provides condition for buck switches. All semiconductors turned on off under condition. addition to reduction switching...
In this paper, an advanced method for implementing active thermal control is proposed that can be helpful smoothing repetitive junction temperature swing, which one of the main reasons wear-out failure in Wide bandgap (WBG)-based (i.e., SiC) power electronics converters (PEC). Utilizing current-source gate-drive, rise/fall (t <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> /t xmlns:xlink="http://www.w3.org/1999/xlink">OFF</inf> ) time...
In this paper, a non-isolated coupled-inductor high step-down converter with extended duty cycle is proposed, which operates under discontinuous conduction mode. The soft-switching condition provided for all the switches and diodes, results in reduction of switching losses, losses related to diode reverse recovery problem. Also, self-drive circuit used automatically generate ON OFF gate signals synchronous rectifier, recovers energy reduces complexity. topology, only single coupled inductor...
High voltage GaN power transistors can significantly improve the key performance indices of a electronic converter in terms efficiency, reliability and density. This brings potentiality for widespread adoption these semiconductors e-mobility applications such as on-board chargers (OBCs) electric vehicles. According to literature surveys, among all semiconductor technologies GaN-based high-electron-mobility (HEMTs) devices are utilized design compact, efficient reliable OBCs. In this paper,...
In this article, the perforation mechanism(s) of polyethylene was investigated through experiments. Several (PE) film samples were fabricated by compression molding technique. order to examine mechanism PE, tests conducted according ASTM F 1306 Standard procedure. The damage and plastic zone areas around perforated area in PE test under cross polarized light condition studied using optical microscope. measured an image analysis For further clarification medium density (MDPE) films,...
This paper investigates and validates the applicability of recently developed stray voltage capture (SVC) ultra-fast short-circuit (SC) detection method its extended version (ESVC) to fault-tolerant multi-motor drives. As these methods are system-based, a fault localization algorithm is also developed. Simulation analysis inverter inductances shows additional challenges for SVC making it hard achieve SC detection. The ESVC slower but overcomes challenges. adapted 400 V 6-phase Silicon...
Health degradation issues in automotive power electronics converter systems (PECs) are present due to repetitive thermomechanical stress endured while the vehicle is real-field operation.This results from heat generation, a byproduct of semiconductor operation within PECs, leading operating life.The best practice academia and industry rely on detailed Physics-of-Failure (PoF) based models for lifetime estimation.However, PoF-based model PECs requires substantial computational time robust...
Electric vehicles (EVs) have gained global attention as a solution to climate change and pollution caused by internal combustion engine (ICEVs). However, the limited driving range long charging time pose challenges for EVs. Higher power density efficiency in electronic systems can increase of Advancements electronics EVs led higher integration smaller components. Therefore, effective thermal management solutions are crucial maintaining device temperatures within acceptable limits densities....
The assessment of Power Electronics Converters (PECs) reliability is a crucial research area for the development robust PECs. key parameter real-time junction temperature (T <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</inf> ) profile semiconductor power switches While complex high-fidelity simulation models with electro-thermal can accurately predict T during offline design phase, their computational requirements make them impractical...
In this article, a new approach for smoothing junction temperature fluctuations through active thermal control is proposed. By utilizing current-source gate drive and controlling switching transition, losses can be regulated in way to swing which dominant reason of wear-out failure mechanisms MOSFETs. The simulation results indicate 29% increase lifetime. Additionally, the experimental demonstrate capability MOSFET effectively.
This paper aims to assess the lifetime of a T-type active front end (AFE) converter in context Grid-to-Vehicle (G2V) and Vehicle-to-Grid (V2G) applications providing various grid services. To achieve this goal, research presents two G2V three V2G profiles measures junction temperature oscillations for entire mission profile. Then, are imported into reliability assessment model determine each profile's impact on system's reliability.