A5046074226- Advanced Authentication Protocols Security
- Cryptography and Data Security
- Advanced materials and composites
- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Aluminum Alloys Composites Properties
- Optical Network Technologies
- Advanced Surface Polishing Techniques
- Nanofabrication and Lithography Techniques
- User Authentication and Security Systems
- Advanced Steganography and Watermarking Techniques
- Advanced machining processes and optimization
- Security in Wireless Sensor Networks
- 3D IC and TSV technologies
Xidian University
2022-2024
Because the majority of information in industrial Internet things (IIoT) is transmitted over an open and insecure channel, it indispensable to design practical secure authentication key agreement protocols. Considering weak computational power sensors, many scholars have designed lightweight protocols that achieve limited security properties. Moreover, these existing are mostly implemented a single-gateway scenario, whereas multigateway scenario not considered. To deal with problems, this...
The existing authentication schemes in wireless sensor networks (WSNs) are mostly used single-gateway mode. With the wide deployment of WSNs, drawbacks mode gradually becoming more noticeable. In traditional high-speed data streams prone to conflict during aggregation, which may reduce performance network. Most multi-gateway based on lightweight operations such as hash functions, exclusive OR (XOR), and symmetric encryption algorithms, cannot achieve forward secrecy. this paper, we propose a...
As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within interposer substrates where mismatched coefficients of thermal expansion exacerbate issues. This study conducts a analysis TSV structures multi-layered complex interposers, analyzes the stress behavior reliability under variable temperature conditions...
Chip bonding, an essential process in power semiconductor device packaging, commonly includes welding and nano-silver sintering. Currently, most of the research on chip bonding technology focuses thermal stress analysis tin–lead solder pressure-assisted sintering, whereas pressureless sintering is more limited. In this study, was studied using finite element software, with as interconnect material. Using control variable method, we analyzed influences temperature, cooling rate, paste...